Thermal conductive filler

To meet the thermal management needs required in electronics and semiconductor fields, we offer a variety of high-performance thermal conductive fillers.

By mixing with resin, these functional materials provide excellent thermal conductivity and electrical insulation.

【Newly Developed Products】

High thermal conductivity spherical fillers

Thermal conductive filler　To meet the thermal management needs required in electronics and semiconductor fields, we offer a variety of high-perf

Products

SilBee

MagBee

AluBee

ANBee

Main Applications

Filler

Characteristics

Spherical, homogenized particlInsulatinges

Low dielectric

Insulating

Low loss

Shell powder

Material

Unit

MagBee

AluBee

SilBee

ANBee

Particle Size

μｍ

30

30

10

40

70

75

80

80

Dielectric Constant (10GHz)

—

5.80

5.81

3.57

5.10

5.94

6.25

4.92

5.06

Dielectric Loss (10GHz)

( x10-4)

16

22

25

34

4.3

9.3

46

34

Thermal Conductivity *1

W/m･K

2.5〜6.0

1.0〜7.5

0.5〜1.0

5.5〜

Tap Density

g/cm3

1.85

2.06

0.93

1.67

1.85

2.30

2.47

2.03

BET Value

m2/g

0.170

0.119

0.814

0.109

0.107

0.899

0.029

0.050

*1：Measured by the laser flash method on a 1 mm thick pressed filler plate.

Contact

Boron nitride powder

Main Applications

Filler

Release agent

Lubricant

Characteristics

High thermal conductivity

Insulating

Lubricating

High filling property

Boron nitride powder

Material

BN-B

BN-BS

BN-E

BN-C

BN-N

BN-S

BN-SS

BN-SL

TW15-H

TW30-W

BN （%）

>99

>99

>99

>99

>99

>99

>99

>99

>99.5

>99.5

B2O3（%）

<0.2

<0.3

<0.2

<0.15

<0.1

<0.1

<0.1

<0.1

<0.1

<0.1

O （%）

<1

<1

<1

<1

<1

<1

<1

<1

<0.3

<0.3

C （%）

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.05

<0.05

Metal impurities（ppm）

<100

<100

<100

<100

<100

<100

<100

<100

<100

<100

H2O remaining（%）

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.3

<0.3

Particle size（μm）

2

<1

5

10

15

30

35

40<

15

30

BET（m2/g）

30

30<

12

9

3

2

1.5

1

3.5

2

◎The value of a table is not a guaranteed performance.

Contact

Industrial diamond powder

Main Applications

Filler

Characteristics

High thermal conductivity

Insulating

Non-reactiv

Industrial diamond powder

Material

CMM

RM201

Purity (%)

>99.9

Thermal Conductivity (W/m･k)

<1000

Electrical conductivity（Ωm）

1x1011

Dielectric Strength (KV/mm)

300

Hardness  (HV)

>7000

© 2019 Sanwa Materials Co.,LTD. All Rights Reserved.

Thermal conductive filler　To meet the thermal management needs required in electronics and semiconductor fields, we offer a variety of high-perf

BN-B

BN-E

BN-C

BN-N

BN-S

BN-SS

BN-SL

TW15-H

TW30-W

BN-BS

>99

>99

>99

>99

>99

>99

>99

>99.5

>99

>99

<0.3

<0.2

<0.2

<0.15

<0.1

<01

<0.1

<0.1

<0.1

<0.1

<1

<1

<1

<1

<1

<1

<1

<0.3

<1

<0.3

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.05

<0.2

<0.05

<100

<100

<100

<100

<100

<100

<100

<100

<100

<100

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.3

<0.2

<0.3

<1

2

5

10

15

30

35

15

40<

30

Particle size（μm）

30<

30

12

9

3

2

1.5

3.5

1

2

BET（m2/g）

>99.9

<1000

1x1011

300

>7000

Thermal conductive filler

To meet the thermal management needs required in electronics and semiconductor fields, we offer a variety of high-performance thermal conductive fillers.

By mixing with resin, these functional materials provide excellent thermal conductivity and electrical insulation.

【Newly Developed Products】

High thermal conductivity spherical fillers

Thermal conductive filler　To meet the thermal management needs required in electronics and semiconductor fields, we offer a variety of high-perf

Products

SilBee

MagBee

AluBee

ANBee

Main Applications

Filler

Characteristics

Spherical, homogenized particlInsulatinges

Insulating

Low dielectric

Low loss

Shell powder

Material

Unit

 MagBee

AluBee

 SilBee

ANBee

Particle Size

μｍ

80

70

75

30

30

10

40

80

Dielectric Constant

(10GHz)）

—

4.92

5.94

6.25

5.80

5.81

3.57

5.10

5.06

Dielectric Constant

(10GHz)）

（x10-4）

46

4.3

9.3

16

22

25

34

34

Thermal Conductivity *1

W/m･K

2.5〜6.0

1.0〜7.5

0.5〜1.0

5.5〜

Tap Density

g/cm3

2.47

1.85

2.30

1.85

2.06

0.93

1.67

2.03

BET Value

m2/g

0.029

0.107

0.899

0.170

0.119

0.814

0.109

0.050

*1：Measured by the laser flash method on a 1 mm thick pressed filler plate.

Contact

Boron nitride powder

Main Applications

Filler

Release agent

Lubricant

Characteristics

High thermal conductivity

Insulating

Lubricating

High filling property

Boron nitride powder

Material

BN-BS

BN-B

BN-E

BN-C

BN-N

BN-SS

TW15-H

BN-S

BN-SL

TW30-W

>99

>99

>99

>99

>99

>99

>99.5

>99

>99

>99.5

BN （%）

<0.3

<0.2

<0.2

<0.15

<0.1

<0.1

<0.1

<0.1

<0.1

<0.1

B2O3（%）

<1

<1

<1

<1

<1

<0.3

<1

<1

<0.3

O （%）

<1

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.05

<0.2

<0.2

<0.05

C （%）

<100

<100

<100

<100

<100

<100

<100

Metal impurities（ppm）

<100

<100

<100

<0.2

<0.2

<0.2

<0.2

<0.2

<0.2

<0.3

<0.2

<0.2

<0.3

H2O remaining（%）

30

40<

30

15

35

15

<1

Particle size（μm）

2

5

10

30<

30

12

9

3

1.5

3.5

2

1

2

BET（m2/g）

◎The value of a table is not a guaranteed performance.

Contact

Industrial diamond powder

Main Applications

Filler

Characteristics

High thermal conductivity

Insulating

Non-reactiv

Industrial diamond powder

Material

RM201

CMM

>99.9

Purity (%)

<1000

Thermal Conductivity (W/m･k)

1x1011

Electrical conductivity (Ωm)

300

Dielectric Strength (KV/mm)

>7000

Hardness  (HV)

Contact

© 2019 Sanwa Materials Co.,LTD. All Rights Reserved.